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LSI Test
  1. T. Ni, W. Jiang, H. Liang, X. Wen, and M. Nie, "Segmentation-Enhanced Overlapped Defect Identification for Multi-Patterns Wafer Maps," IEEE Trans. on Instrumentation & Measurement. (Accepted ).
  2. Z. Guo, A. Yan, Z. Huang, J. Cui, B. Roh, G. Liu, P. Girard, and X. Wen, "Graph-Based Multi-Task Transfer Learning for Fault Ditection and Diagnosis of Few-Shot Analog Circuits," The IEEE Internet of Things Journal. (Accepted ).
  3. T. Ni, W. Rui, M. Niu, Y. Li, C. Zhou, and X. Wen, "A Novel Approach to Reducing Testing Costs and Minimizing Defect Escapes Using Neighborhood Range and Shapley Val;ues," ACM Trans. on Design Automation of Electronic Systems. (Accepted).
  4. W. Zhan, Y. Zhou J. Zheng, X. Cai, Q. Zhang, and X. Wen, "A Method for Grading Failure Rates within the Dynamic Effective Space of Integarted Circuits after Testing," Applied Sciences, 2025, 15, 2009.
  5. X. Wen, "LSI Testing: A Core Technology to A Successful LSI Industry," Proc. of IEEE Int'l Conf. on ASIC, Paper P0065, Kunming, China, Oct. 2021.